Table Tennis
Kan Yew Hoong
Staff Engineer/AE Manager
Penang
Summary
Product Lead / Subject Matter Expert (SME) / Product Management leading optical manufacturing readiness for silicon photonics, optical transceivers, and OSA platforms. Drives NPI, equipment qualification, yield improvement, and failure analysis for 100G to 1.6T products, partnering with global customers and cross-functional engineering teams to release advanced assembly lines on schedule. Turns process data into manufacturability gains, higher throughput, and clearer customer decisions.
Overview
4
4
Languages
25
25
years of professional experience
Work History
Product Lead / Subject Matter Expert (SME) / Product Management
Jabil Penang (Plant 1 & Batu Kawan)
09.2021 - Current
- Senior Engineering Leader with 24+ years of experience in optical communications, silicon photonics, optical transceivers, EDFA systems, optical sub-assemblies (OSA), and high-volume manufacturing.
- Proven track record in equipment qualification, new product introduction (NPI), yield improvement, failure analysis, process optimization, and customer engagement. Led successful qualification and ramp-up of advanced optical manufacturing platforms supporting 100G, 400G, 800G, and 1.6T products for global customers including Intel and Nokia.
- Experienced in managing cross-functional engineering teams, statistical analysis (DOE, GR&R, ANOVA, Minitab), and driving manufacturing excellence through data-driven decision making.
- Intel Optical Sub-Assembly Program (2023–2026)
- Equipment and Product Qualification
- Qualified five Lens Alignment Machines (Ficontec) and 7TX/RX FAU Alignment Machine for Intel optical DR4 module production.
- Qualified 4 Lens Alignment Machines (Ficontec) and 4 TX/RXFAU Alignment Machine for Intel optical DR8 module production.
- Qualified 4 Lens Alignment Machine (Fioctect) and 3 TX FAU Alignment Machine and 3 RX Alignment Machine for 2XFR4 Product.
- Qualified 2 Lens Alignment Machine(ADST) and 4 FAU Alignment Machine (ADST) for DR8/2XFR4/1.6T Module Production/NPI.
- Led qualification activities for:
- O Intel Gen 1 Optical Sub-Assembly products
- O Intel Gen 3 Optical Sub-Assembly products
- O 800G optical module (NPI)
- O 2XFR4 NPI/1.6T
- Key Contributions
- Supported new product introduction (NPI), process development, and manufacturing readiness activities.
- Partnered with cross-functional teams and customers to achieve on-time equipment qualification and product release milestones.
- Drove process optimization initiatives to improve manufacturability, product quality, and production yield.
- O Improve the TX/RX gripper with vacuum function with better pick up and gripping process.
- O Improve the 2XFR4 FAU holder (ficontec) to control 90 degree hold positions.
- O Improve the DR8 ADST MPO holder, prolong the MPO insertion from 100 insertion to 350 (min)
- O Collaborated with Ficontec team to implement dry alignment at DR8 product-FAU Alignment.
- Provided technical leadership and SME support for advanced optical assembly and alignment technologies.
- Nokia Silicon Photonics Program (2021–2023)
- Auto Aligner Qualification and Yield Improvement
- Lead the qualification of six automated alignment systems for Nokia Silicon Photonics IC manufacturing.
- Improved alignment yield from 20% to 98% through process optimization and equipment enhancements.
- Increased auto-alignment machine throughput from approximately 8 units to 22 units per shift per machine, representing a 175% productivity improvement through algorithm optimization, cycle-time reduction, and process enhancements.
- Increased Semi Finish Product post-bake yield from 70% to 98% through comprehensive root cause analysis and corrective actions.
- Key Improvements
- Optimized alignment algorithms to improve alignment accuracy and repeatability.
- Enhanced fiber gripper design and handling methods to reduce variation during assembly.
- Improved epoxy dispensing process for better alignment stability and reliability.
- Revised UV curing specifications to improve process consistency.
- Upgraded machine architecture with dual-vision USB interfaces to improve system and CPU stability.
- Failure Analysis and Customer Engagement
- Conducted extensive failure analysis and demonstrated that low photodiode (PD) current failures after bake were not caused by the alignment process.
- Identified incoming Silicon Photonics IC material defects as the root cause, specifically solder pump delamination and discontinuity issues occurring during epoxy curing and post bake in semi finish process.
- Led cross-sectional investigations across multiple failure modes and successfully aligned customer understanding that high fallout rates at semi-finished and final test stages were driven by incoming material quality issues.
- Nokia Program (2023–2024)
- MZ High Insertion Loss (IL) Investigation
- Collaborated with Test Engineering and Lean Manufacturing teams to investigate high insertion loss (IL) failures in Mach-Zehnder (MZ) devices.
- Utilized Minitab statistical analysis and ANOVA to evaluate potential process variables, including:
- O Machine variation
- O Operator variation
- O Wafer lot
- O Wafer ID
- O Wafer position
- O Test station
- Presented analytical findings to the customer and successfully demonstrated that the primary contributor to MZ IL rejects was incoming wafer material variation rather than manufacturing process performance.
- Malaysia
- Industry: Telecommunications (Manufacturing/NPI)
Product Management / Engineering Leadership
Venture Electronics Services
06.2012 - 08.2021
- EDFA Product Engineering Lead (2012 – 2017)
- Leadership & Product Ownership
- Completed intensive training on EDFA (980nm Pump) products and manufacturing processes in Shenzhen, China.
- Led a cross-functional team comprising 4 Operators, 2 Trainers, 2 Process Engineers, and 4 Product Engineers.
- Managed a portfolio of optical amplifier products including:
- O MB (micro block)
- O FNC GBK
- O Cisco Line Card
- O Ciena CPL
- Supported products ranging from single-stage single-channel amplifiers to three-stage C-band and L-band optical amplification systems.
- Manufacturing & Customer Support
- Led BOM implementation, Engineering Change (EC) execution, and customer-driven product changes.
- Conducted weekly yield reviews with customers and coordinated corrective actions for product quality issues.
- Led root cause analysis (RCA) and corrective/preventive actions (CAPA) for customer returns and manufacturing yield losses.
- Improved manufacturing processes for:
- O High-density power connector assemblies (~60-pin connections) (Appreciated by customer and end customer)
- O EDFA fiber coiling operations
- O Statistical Process Control (SPC) implementation
- Enhanced fiber handling practices through operator and trainer certification programs and established safety standards for fiber-optic manufacturing.
- Conducted weekly reviews on critical optical performance parameters, including:
- O Optical Power
- O Noise Figure
- O Gain
- O Isolation
- O Tilt
- Test Equipment & Process Qualification
- Established and qualified optical test benches using Gage R&R methodology and Minitab statistical analysis.
- Qualified new production work cells including:
- O Fusion splicers
- O Precision cleavers
- O Ultrasonic cleaning systems
- O Fiber handling tools
- Developed and qualified new fusion splicing recipes for various fiber combinations.
- Managed critical spare-part inventory including electrodes, cleaver blades, and splicer maintenance tools.
- Implemented SPC (X-bar & R Chart with 7 SPC Rules) for splice quality monitoring, with pull-strength as the key process indicator.
- Supported and maintained approximately:
- O 15 optical splicing work cells
- O 2 Pretest Station, 7 Module Calibration Station, 7 Final Test Station
- Product & Process Engineer – Tunable Laser Products (2017 – 2018)
- TX Gold Box (Butterfly Package) and 10G Tunable Products
- Managed product and process engineering activities for tunable laser transmitter products.
- Reduced RTV backlog by resolving laser chip contamination-related failures through detailed defect analysis.
- Successfully recovered and reclaimed Gold Box rejects by proving failure mechanisms originated from incoming laser chip defects.
- Provided engineering support for:
- O Lens alignment processes
- O Receptacle alignment processes
- O Manufacturing yield and quality improvement initiatives
- RMA & Product Engineer (2018 – 2021)
- Optical Transceiver Product Support
- Served as lead RMA Engineer supporting 100G ITXA transceiver products.
- Performed product failure analysis using:
- O Debug stations
- O Optical test systems
- O Digital multimeters
- Recommended component replacement and rework solutions for customer approval and field returns.
- Provided technical support for:
- O TSFF 10G
- O ITLA 100G
- Yield Improvement & Change Management
- Generated daily yield reports and performed root cause analysis for yield excursions on:
- O CFP2-ACO
- O ITXA 100G products
- Supported Back Facet Monitor (BFM) assembly and testing activities.
- Led weekly Engineering Change reviews involving:
- O BOM updates
- O Work Instruction revisions
- O Labeling changes
- O Manufacturing process updates
- Penang, Malaysia
- Industry: Telecommunications
OSA Manufacturing and Test Engineering Leader
Finisar Malaysia Sdn. Bhd.
10.2010 - 06.2012
- Managed Optical Sub-Assembly (OSA) products and test operations.
- Led a team of:
- O 12 Test Technicians
- O 6 Product Technicians
- O 9 Engineers
- Supported product families including:
- O 4G, 8G, and 10G TOSA
- O PIN and APD ROSA products
- O Plastic and metal package platforms
- Key Achievements
- Improved manufacturing yield by 3% through analysis and correction of XYZ welding alignment variations.
- Increased final test yield from approximately 90% to 99% by identifying and eliminating alignment and operator handling issues.
- Collaborated with R&D to resolve high-noise failures through design and current-hopping parameter optimization.
- Conducted failure analysis on high-temperature LIV-1h rejects across three-temperature qualification testing. And identified the root caused.
- Developed and delivered technical training programs for test technicians to enhance troubleshooting and product analysis capability.
- Perak, Malaysia
- Industry: Telecommunications
Venture Electronics Services (Penang) Sdn. Bhd.
10.2006 - 10.2010
- Equipment Transfer, Qualification & Test Engineering
- Transfer, installation, qualification, and support for:
- O ROADM Final Test Stations
- O DmuxT Final Test Stations
- O AWG Sub-Assembly Test Stations
- O TVOA Sub-Assembly Test Stations
- O Photodiode Array Test Stations
- Conducted Gage R&R studies and correlation analysis between Venture Penang and customer sites in Milpitas, California.
- Performed troubleshooting and root cause analysis for production test station failures.
- Evaluated and validated software releases for manufacturing test systems.
- Coordinated offshore calibration activities with vendors including SIMCO and JDSU/Acterna.
- Localized spare-part sourcing from U.S. suppliers to regional vendors, reducing lead time and support costs.
- Managed equipment uptime, preventive maintenance, and calibration programs.
- Developed and delivered training programs for technicians, trainers, and operators.
- Major Projects
- Spent six months in Milpitas, California supporting ROADM and DmuxT production transfer activities.
- Successfully transferred and qualified:
- O 27 ROADM test stations
- O 4 AWG test stations
- O 6 TVOA test stations within 18 months.
- Implemented plant-wide UPS solutions across the ROADM production line to improve operational reliability.
- Developed and prepared next-generation NPI test platforms.
- Optical Test System Expertise
- Swept Wavelength System (SWS)
- JDS Uniphase OWB1002 Optical Workbench
- JDS Uniphase SWS 20006 Controller
- JDS Uniphase SWS 15107 Detector Module
- Source Optical Module (SOM)
- Capabilities:
- Broadband measurements from 1420nm to 1630nm covering S, C, and L bands.
- Simultaneous testing of up to 128 optical channels.
- IL, PDL, bandwidth, center wavelength, crosstalk, flatness, and isolation measurements.
- Malaysia
Optical Sub-Assembly Manufacturing Engineer
Finisar Malaysia Sdn. Bhd.
10.2001 - 10.2006
- Led continuous improvement initiatives to enhance manufacturing yield and process capability.
- Conducted Gage R&R, reliability studies, and process correlation analysis.
- Performed root cause analysis and corrective actions for manufacturing defects.
- Evaluated and implemented manufacturing software enhancements from Finisar Sunnyvale and Finisar Ipoh.
- Developed training materials and certification programs for technicians, trainers, and operators.
- New Product Introduction (NPI)
- 4G TOSA and ROSA Program (2004–2006)
- Supported NPI development, process characterization, and manufacturing ramp-up activities.
- TOSA GBIC Program (2002–2003)
- Participated in:
- O Design Verification Test (DVT) Phase 2 & 3
- O Manufacturing Verification Build (MVB)
- Key contributions:
- Process characterization and manufacturability assessment.
- Benchmarking against existing products.
- Finalization of process parameters and manufacturing specifications.
- FMEA development for assembly and final-test processes.
- Major Achievement: New Epoxy Qualification
- Dymax OP-60 Light-Cure Epoxy Qualification
- Designed and executed DOE studies to characterize:
- O Dispensing pressure
- O Needle tip size
- O Dispensing time
- O Epoxy volume
- Collaborated with Articure to qualify a new curing system.
- Results:
- Improved final test yield from 93% to 98.5%.
- Reduced UV curing time from 40 seconds to 20 seconds without additional capital investment.
- Improved TOSA stability by reducing optical drift.
- Lowered manufacturing cost per unit.
- Major Achievement: Automated Alignment Conversion
- Converted GBIC assembly process from manual alignment to automated alignment.
- Increased alignment yield from 60% to 95%.
- Eliminated operator-to-operator variation.
- Improved optical power consistency and reduced alignment drift.
- Enhanced Light Attenuation (LA) performance and long-distance transmission reliability.
- Qualify 24 Multimode TOSA Auto Alignment System and 24 Multimode ROSA Auto Alignment System with Equipment Test Support.
- Perak, Malaysia
Education
Bachelor of Science - Electrical, Electronics And Communications Engineering
Multimedia University
Cyberjaya, Malaysia 04.2001 -
Skills
Silicon Photonics Manufacturing
Optical Sub-Assembly (OSA) Technology
Equipment Qualification & Validation
New Product Introduction (NPI)
Failure Analysis
Production line leadership
Cross-functional team management
Performance management
Hiring & onboarding
Executive reporting
Budget management
Capacity planning
Supplier quality management
Change control management
Risk register management
Interests
Timeline
Product Lead / Subject Matter Expert (SME) / Product Management
Jabil Penang (Plant 1 & Batu Kawan)
09.2021 - Current
Product Management / Engineering Leadership
Venture Electronics Services
06.2012 - 08.2021
OSA Manufacturing and Test Engineering Leader
Finisar Malaysia Sdn. Bhd.
10.2010 - 06.2012
Venture Electronics Services (Penang) Sdn. Bhd.
10.2006 - 10.2010
Optical Sub-Assembly Manufacturing Engineer
Finisar Malaysia Sdn. Bhd.
10.2001 - 10.2006
Bachelor of Science - Electrical, Electronics And Communications Engineering
Multimedia University
04.2001 -